eUICC Specifications

# Product Features

eUICC
Max Profiles 10
Specification SGP 22 v2.3
JavaCard
Specification JavaCard v3.0.4
Extension APIs UICC API (ETSI 102241)
USIM API (ETSI 131130)
GlobalPlatform API
Algorithms DES/AES/SM1/SM4
RSA//ECC/SM2
CRC16/CRC32
MD5/SHA1/SHA256/SM3
HMAC
GlobalPlatform
Specification V2.3
Security Channel SCP 02/SCP 03/SCP 80/SCP 81
UICC
Logic Channel 8 (4 contact channels + 4 contactless channels)
USIM
Milenage Algorithm Supported
TUAK Supported
ISIM Supported

# Hardware Specifications

Product Industrial grade patch Consumer grade patch plug in Consumer plug in
Encapsulation QFN8
QFN8
plug in
Size 5 mm x 6 mm
4 mm x 4.2 mm
2.5 mm x 2.7 mm
5 mm x 6 mm
4 mm x 4.2 mm
2.5 mm x 2.7 mm
2FF
3FF
4FF
Operation Temperature -40°C to + 105°C -25°C to + 85°C
Operation System
  • Supports 2G/3G/4G/5G networks, conforming to China Unicom’s relevant IoT card specifications
  • Super long service life (> 500,000 data erasures)
  • Support data message customization application (such as OTA application over-the-air loading, etc.)
  • Supports 2G/3G/4G/5G networks, conforming to China Unicom’s relevant IoT card specifications
  • Support 100,000 data erasures
  • Support data message customization application (such as OTA application over-the-air loading, etc.)
  • Electrical Features Voltage Range: from 1.62V to 5.5V
    Maximum working current: < 10ma @ 5v; < 6 mA @ 3.3 V; < 4 mA @ 1.98 V
    ESD Protection Larger than 4000 V (HBM)
    Note: If you need to customize the package size, please contact us for consultation.

    # Security Features

    Authentication Algorithm Supported Comp128-v1, Comp128-v2, Comp128-v3,Comp128-v4, milenage
    Security Algorithm Supported DES, 3DES (ECB and CBC mode),SHA-1, MD5
    Certified Security Level EAL4+
    Security Protection Single power attacks (SPA)
    Differential power attacks (DPA)
    Fault attacks (FA)
    Certification GSMA certificate and CAICT certificate are supported
    Recommended Welding Temperature Curve of Module (Lead-free Process)

    # Encapsulation Size and Pin Definition (5 mm x 6 mm)

    Structural Dimension Drawing of MFF2 (Bottom View)
    Note: The inner joint can be rectangular or circular. For the comparison of the encapsulation pins and UICC contacts, see the above figure.

    # Size of MFF2

    parameter Description Size (mm)
    E Horizontal length of the encapsulation 6.00 ± 0.15
    D Vertical length of the encapsulation 5.00 ± 0.15
    L Horizontal length of external pins 0.60 ± 0.15
    B Minimum vertical distance of external metal pins 0.40 ± 0.10
    E2 Horizontal length of internal heat sink min 3.30
    D2 Vertical length of internal heat sink min 3.90
    K Minimum distance between the external pin and the internal heat sink min 0.20
    E Distance between the external metal pin centerline and the adjacent metal pin centerline 1.27 tolerances are described in bbb and ddd
    Bbb Tolerance of centerline 0.10
    Ddd Tolerance of distance between contacts 0.05

    # Pin Description

    Pin No. Definition Description Remarks
    PIN1 GND 7816 interface universal ground -5.5V~+5.5V (Please do not exceed during testing)
    PIN2 NC Not occupied /
    PIN3 IO 7816 interface input and output -5.5V~+5.5V (Please do not exceed during testing)
    PIN4 NC Not occupied /
    PIN5 NC Not occupied /
    PIN6 CLK 7816 interface clock -5.5V~+5.5V (Please do not exceed during testing)
    PIN7 RST 7816 interface resetting -5.5V~+5.5V (Please do not exceed during testing)
    PIN8 VCC 7816 interface power -5.5V~+5.5V (Please do not exceed during testing)